Project title: Wafer-based Manufacturing of Integrated Camera Module for Cell-phones.
Short description of project
Manufacture a lens-module for portable electronics and high performance 3 Mpixel cell-phones, based on 50-mm wafers with 150 lenses pr. wafer, using wafer stacking and wafer level packaging techniques.
Funding source: Danish National Advanced Technology Foundation (HTF)
Total budget: 25.2 MDKK;
Group budget: 2.6 MDKK.
Period: 2009-2012.
Academic partners: DTU Mechanical Engineering, Risø DTU
Industrial partners: Kaleido Technology ApS, Nokia Denmark A/S, CemeCon Scandinavia A/S
Participants from group: Jiri Cech and Rafael Taboryski
Ansvarlig:
Rafael J. Taboryski